S10 Surface Mount Technology | Mounter

45,000 cph

(single beam)

0201 metric

120 x 90 mm x 30 mm
parts

Dispensing

Option

3D MID

Capable

Features

Production Revolution Ultimate flexibility Color fiducial camera

Enhancement to 3D MID

Max. feeder capacity 180 lanes

Large board handling capability

Wide range component handling capability

CFB/CTF full compatibility

Model	S10
Board size (with buffer unused)	Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955)
Board size (with input or output buffers used)	3Min. L50 x W30mm to Max. L420x W510mm
Board size (with input and output buffers used)	Min. L50 x W30mm to Max. L330x W510mm
Board thickness	0.4 – 4.8mm
Board flow direction	Left to right (Std)
Board transfer speed	Max 900mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.	0.08sec/CHIP (45,000CPH)
Placement accuracy A (μ+3σ)	CHIP +/- 0.040mm
Placement accuracy B (μ+3σ)	IC +/- 0.025mm
Placement angle	+/- 180 degrees
Z axis control/ Theta axis control	AC servo motor
Component height	Max 30mm*1 (Pre-placed components: max 25mm)
Applicable components	0201mm – 120 x 90mm, BGA, CSP, connector, etc.
Component package	8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray
Drawback check	Vacuum check and vision check
Screen language	English, Chinese, Korean, Japanese
Board positioning	Board grip unit, front reference, auto conveyor width adjustment
Component types	Max 90 types (8mm tape), 45 lanes x 2
Transfer height	900 +/- 20mm
Machine dimensions, weight	L1250 x D1750 x H1420mm, Approx. 1150kg

*1) Board thickness + Component height = Max 30mm
Some specifications and parts of the external appearance are subject to change without notice.