i-Cube10 Hybrid Placer i-Cube10 Overview

Handling Large


Hybrid mounting Realize mixed mounting of semiconductor and SMD

High-speed and high-accuracy mounting ±15μm(Cpk≧1.0) CPH10,800(when die is supplied from wafer) Note: under optimum conditions

Upgraded component supply Intelligent feeder

Handling Large PCBs L330 x W250mm

Additional Features


i-Cube10 (YRH10)
Applicable PCB L50 x W30mm to L330 x W250mm
PCB thickness 0.1 to 4.0mm
PCB conveyance direction Left ⇒ Right (option : Right ⇒ Left)
Conveyer reference Front
Mounting accuracy (Cpk≧1.0) ±15μm
Mounting capability 10,800 CPH (when die is supplied from wafer) Note : under optimum conditions
Number of component types Reel : Max. 48 types (conversion for 8mm tape feeder)
Wafer : Max. 10 types
Die Die size □0.35 to □16mm Note
Die thickness 0.1 to 0.5mm Note
Wafer size 6 to 8 inch wafers, 2 to 4 inch waffle trays
Wafer magazine Wafer : Max. 10 types
SMD Component size 0201 to □16mm, H15mm (multi camera)
0201 to □12mm, H6.5mm (scan camera)
Tape size 8 to 104mm
Max feeder count Max. 48 types (for 8mm feeder)
Power supply 3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz
Air supply source 0.45 MPa or more, in clean, dry state
External dimension L1,252 x W1,962 x H1,853mm
Weight Approx. 1,560kg

Note : The minimum size should be checked on an actual machine.
Specifications and appearance are subject to change without prior notice.

External dimension


i-Cube10 | Surface Mount Technology | Flip Chip Bonder

Flip Chip Bonder