YSB55w Surface Mount Technology | Flip Chip Bonder

+/-5µm (3σ)
2 ~ 30mm 2
die size
300 mm
Wafer Capable


High bonding accuracy and x3 productivity of conventional machines! This brings a New Era in Semiconductor packaging for the expanding flip chip market.

High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH

High-Accuracy ±5μm (3σ)

High-Quality & Flexibility


Model YSB55w
Applicable substrate L240 x W200 to L50 x W50mm
Substrate thickness 0.2 to 3.0mm
Transport direction Left to Right (option : Right to Left)
Bonding accuracy ±5µm (3σ) (When using Yamaha’s standard components)
Throughput 13,000UPH (Including processing time)
Applicable wafer size 12 inch wafer
Applicable die size □2 to 30mm
Power supply 3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz
Air supply 0.45MPa or more
External dimension L2,090 x D1,866 x H1,550mm (YSB55w main unit & wafer feed unit)
Weight Approx. 3,600kg (YSB55w main unit & wafer feed unit)
* Specification and appearance are subject to change without prior notice.

YSB55w | Surface Mount Technology | Flip Chip Bonder

Flip Chip Bonder