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YSB55w Surface Mount Technology | Flip Chip Bonder
High-Accuracy
+/-5µm (3σ)
Throughput
13,000UPH
2 ~ 30mm 2
die size
300 mm
Wafer Capable
Features
High bonding accuracy and x3 productivity of conventional machines! This brings a New Era in Semiconductor packaging for the expanding flip chip market.
High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
High-Accuracy ±5μm (3σ)
High-Quality & Flexibility
Specifications
| Model | YSB55w |
| Applicable substrate | L240 x W200 to L50 x W50mm |
| Substrate thickness | 0.2 to 3.0mm |
| Transport direction | Left to Right (option : Right to Left) |
| Bonding accuracy | ±5µm (3σ) (When using Yamaha’s standard components) |
| Throughput | 13,000UPH (Including processing time) |
| Applicable wafer size | 12 inch wafer |
| Applicable die size | □2 to 30mm |
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz |
| Air supply | 0.45MPa or more |
| External dimension | L2,090 x D1,866 x H1,550mm (YSB55w main unit & wafer feed unit) |
| Weight | Approx. 3,600kg (YSB55w main unit & wafer feed unit) |
| * Specification and appearance are subject to change without prior notice. | |