YSi-SP Surface Mount Technology | Paste Inspector

3D Solder &

Bond coating Inspection

Offset Feedback

SPI Linked

to all mounting
machines

SPC

with diverse
statistical processing

Features

Simplified single head solution for reduced maintenance & reliability

3D 3-step algorithm and 2D contour extraction yields high precision at high speed

A thorough and extensive machine-to-machine (M2M) solution

Statistical Process Control (SPC) for diverse statistical processing

Optional features to enable handling various products

Model	YSi-SP
Applicable PCB	L 510 x W 460 mm to L 50 x W 50 mm (single lane spec) *No dual lane specification available.
Horizontal resolution (FOV size)	1）25 µm / 12.5 µm (approx. 50 x 50 mm) 2）20 µm / 10 µm (approx. 40 x 40 mm) 3）15 µm / 7.5 µm (approx. 30 x 30 mm) *All are standard selection type.
Power supply	3-phase AC 200/208/220/240/380/400/416 V +/- 10%
Height resolution	1 µm
Inspection items	Solder paste printing quality (volume, height, area and misalignment)
Power supply	Single-phase AC 200 V–230 V ±10 %
Air supply source	Airless specification
External dimension	L 904 x W 1,080 x H 1,478 mm
Weight	Approx. 550 kg